TSMC plans to build three CoPoS advanced packaging plants in the Longtan expansion to Hsinchu Science Park, media report, citing TSMC applications to the park and unnamed supply chain sources. CoPoS (Chip-on-Panel-on-Substrate) is one of the new technologies TSMC is developing to combine more chips into a single system, packaged together. It is also evaluating Fan-out Panel-Level-Packaging (FOPLP), and others. The shortage of CoWoS prompted TSMC to speed construction of 2 plants in Chiayi (AP7), and the retrofit to a display plant purchased from Innolux. The Longtan area will be ready for plant construction by 2029. CoPoS is expected to be in mass production in 2028-2029. $Taiwan Semiconductor(TSM.US) $Intel(INTC.US) $SSNLF $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) $KLA(KLAC.US) $CAJ $Camtek(CAMT.US) #semiconductors

Source: Dan Nystedt