ASE, the chip packaging giant, joined WUS on an NT$35.2 billion (US$1.1 billion) advanced semiconductor packaging plant in Kaohsiung, south Taiwan for FoCoS (Fan-out-Chip-on-Substrate) and FC BGA (Flip Chip Ball Grid Array) chip packaging for AI, cloud computing, autonomous driving, media report, adding the new plant will begin operations in Sep. 2029. $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) #WUS #Taiwan #semiconductors #semiconductor
Source: Dan Nystedt
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