Nvidia’s first big batch of Rubin chips will finish (final packaging) in July-August and start being delivered to system assembly partners, media report, citing unnamed supply chain sources. TSMC began manufacturing the initial batch in late-March-early April, reaching monthly wafer starts of 40-50,000wpm in the 2nd quarter, and expects to be in mass production in the 3rd quarter. The cycle time from wafer start to final CoWoS package is about 4-months. $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) #KYEC #SPIL #Unimicron #Kinsus #Winway #MPI
Source: Dan Nystedt
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