TSMC’s inability to meet CoWoS demand has sent overflow orders to packaging specialists ASE, Powertech, media report, adding ASE raised its 2026 capex to US$8.5 billion from $7 billion to meet demand for Leading Edge Advanced Packaging (LEAP) related to AI servers, high-speed networking and automotive, which is projected to bring in revenue of $3.5B, up from $3.2B previously. $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) #Powertech
Source: Dan Nystedt
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