TSMC has teamed up with Japan’s Ibiden and Innolux (Taiwan) to speed CoPoS advanced packaging and glass substrates development, DigiTimes reports.
Innolux is seen as a vital partner for glass substrates for TSMC's next generation CoWoS, to help with warpage, thermal management, signal transmission, power delivery.Glass substrates indicated big improvements, though further testing is needed:-Chip-on-Package (CoP) warpage indicators improved 16%, controlling warpage-Effective CTE (Thermal) reduced by 19%-Effective Modulus increased 31%Power Integrity:-Resistance value reduced 27%-Inductance value reduced 42%CoPoS: Chip-on-Package-on-SubstrateCoWoS: Chip-on-Wafer-on-Substrate$Taiwan Semiconductor(TSM.US) #Ibiden #InnoluxSource: Dan Nystedt
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