TSMC has already secured global AI chip clients for its next-generation CoPoS advanced packaging (Chip-on-Panel-on-Substrate), Taiwan media report, noting TSMC is moving faster on CoPoS due to pressure from Samsung’s head start on panel-level packaging, but that TSMC’s CoPoS timeline likely remains 2028 for commercialization, since the earliest the tech will be ready is 2027. $Taiwan Semiconductor(TSM.US) $SSNLF $Intel(INTC.US) #Samsung #semiconductors #CoPoS
Source: Dan Nystedt
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