TSMC Technology Symposium (Shanghai) Takeaways, media report:
-6T SRAM breakthrough with 30% area reduction on nanosheet (GAA)-CoWoS 5.5x reticle size hit 98% yield in mass production-N2 wafer output in 1st year to beat N3’s 1st year output by 45%-N2/A16 capacity expected to expand at 70% annually (CAGR) 2026-2028-N3 and N5 will see 25% annual increase (CAGR) 2022-2026-Advanced packaging CoWoS and SoIC to expand 80% annually (CAGR) 2022-2027-From 2022 to 2026 demand for AI accelerator wafers grew 11x, while large-die wafer demand grew 6x-AI and high performance computing (HPC) chips will account for 55% of the US$1.5 trillion semiconductor market by 2030 ($1 trillion this year), smartphones 20%, and 10% each for automotive and IoT. $Taiwan Semiconductor(TSM.US) $Qualcomm(QCOM.US) $NVIDIA(NVDA.US) $Apple(AAPL.US) $Alphabet(GOOGL.US) $Amazon(AMZN.US) #semiconductorsSource: Dan Nystedt
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