TSMC has tapped ShunSin Technology, a Foxconn chip packaging & testing subsidiary, for Fiber Array Unit (FAU) and Grating Coupling work as part of its COUPE optical engine platform, media report, citing ShunSin Chairman Shang-Yi Chiang, former head of R&D at TSMC.
-Two former TSMC executives added to ShunSin board-Sees double-digit % revenue growth this year and bigger growth in 2027.-Capex seen NT$4-5 billion for 2026-2027-New Vietnam plant to see output by end-2026 and ramp up in 2027-51.2T CPO currently in pilot production -102.4T CPO samples have been sent to clients-In development: 12.8T NPO, OCS (optical circuit switches) and 3.2T packaging(Note: 51.2T is the current standard for cutting-edge network switch chips like Broadcom Tomahawk or Nvidia Spectrum-X. So, 51.2T stands for 51.2Tbps bandwidth for network switch chips, which allow 1000s of GPUs in AI data centers to talk to each other)$Taiwan Semiconductor(TSM.US) #Foxconn #ShunSin #semiconductors #SiPhSource: Dan Nystedt
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