Rumor: China CCL giant Kingboard notified clients it plans to hike prices 15% on FR-4 and Prepreg, and on CEM-1/22F 10%, due to the rising cost of materials like E-glass fabric and copper foil, while copper foil processing fees will also rise, media report. Prepeg is a bonding material used in multilayer circuit board lamination (AI server boards layers are rising: Blackwell GPU boards 28-34-layers vs Vera Rubin 32-40 or more, versus a general purpose server board’s 8-12 layers).
Source: Dan Nystedt
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