SK Hynix was on the verge of bankruptcy over a decade ago, with its memory business almost wiped out by Samsung. TSMC's Chiang Shang-yi led a team to South Korea to support SK Hynix in developing TSV technology, which is today's HBM. At that time, TSMC was already working on 3D packaging, which also required TSV. Therefore, SK Hynix was revived by TSMC. Their CEO has thanked TSMC in the media
on multiple occasions.
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