Corning's new glass bridge technology targets the CPO market!

Optical fiber giant Corning recently released a blockbuster CPO product called Glass Bridge, a new generation of glass-based optical interconnect technology, aimed at solving the most difficult process in CPO—optical coupling.

You should know that traditional CPO packaging requires aligning optical fibers and silicon photonic chips point by point, which is slow, expensive, and has a low yield rate.

The concept of this Glass Bridge is to directly create optical waveguides within the glass, pre-engraving the alignment coordinates into the glass. During assembly, there's no need for individual light adjustment; instead, components are directly plugged in according to the coordinates.

So the market has been speculating on glass drilling these past two days. However, the real core value isn't just the drilling equipment, but also low-iron specialty glass, ion-exchange waveguides, and optical coupling processes.

Of course, this approach is still in the verification stage, and it will take considerable time before true mass production. But it at least indicates one thing: the core of the next-generation AI optical interconnect competition might be gradually shifting from electrical interconnects to optical interconnects.

$Corning(GLW.US)$Lumentum(LITE.US)$Marvell Tech(MRVL.US)$Invesco QQQ Trust(QQQ.US)$NVIDIA(NVDA.US)$Applied Optoelectronics(AAOI.US)$Coherent Corp.(COHR.US)