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Kulicke and Soffa
KLIC.US
Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and consumables in China, the United States, Taiwan, Malaysia, Japan, the Philippines, Korea, Hong Kong, and internationally. It operates through four segments: Ball Bonding Equipment, Wedge Bonding Equipment, Advanced Solutions, and Aftermarket Products and Services (APS). The company provides services used to assemble semiconductor devices, such as integrated circuits, power discretes, light-emitting diode (LEDs), and sensors.
1.254 T
KLIC.USMarket value -Rank by Market Cap -/-

Financial Score

05/12/2025 Update
C
Semiconductor Materials and EquipmentIndustry
Industry Ranking22/34
Industry medianC
Industry averageC
Score Analysis
Peer Comparison
  • Criteria
    Rating
  • Profit ScoreC
    • ROE0.02%D
    • Profit Margin0.03%D
    • Gross Margin48.97%B
  • Growth ScoreD
    • Revenue YoY-7.38%D
    • Net Profit YoY100.31%A
    • Total Assets YoY-10.95%E
    • Net Assets YoY-12.98%E
  • Cash ScoreB
    • Cash Flow Margin307080.28%A
    • OCF YoY-7.38%D
  • Operating ScoreC
    • Turnover0.56C
  • Debt ScoreB
    • Gearing Ratio25.61%B

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Institutional View & Shareholder

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    News
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    Fantastic report and call from #ASMPT ($ASMPT(522.HK)) with numerous industry implications:

    Here are some of the key points:

    · Booking and Q3 revenue guide above expectations

    · China demand strong; EV an...........................

    As #AdvancedPackaging become more important and enabling, we are likely to see in increase in the number of tool suppliers.

    "Hanwha Semiconductor has established the 'Advanced Packaging Equipment Devel.........

    Chinese company, Qinghe Wafer, recently announced a Hybrid Bonding tool with impressive specs:

    ▫️Bonding accuracy: 100nm

    ▫️UPH: 1,000

    I'd assume those don't go together; meaning they are not hitting 100n...............

    Chips & Wafers was created to go deeper than this report from JP Morgan.

    The reality is that WFE is far too broad a term to be a meaningful metric.

    WFE includes:

    · Bare Wafer Manufacturing tools like ha.......................................

    $Micron Tech(MU.US) to move towards Fluxless TCB for their next gen #HBM.

    Once again, the HBM competition is heating up around the specific packaging technology being employed.

    $SEC #SKHynix #ASMPT $Kul......