Rumor: SpaceX executives will visit Taiwan later this month for advanced chip packaging (FOPLP) and PCBs (printed circuit boards) help, as yields at new plants in Texas are far below expectations, prompting it to postpone mass production to mid-2027 from Q3-2026, media report, so SpaceX’s Taiwan suppliers Innolux, Compeq, Unitech PCB, others, will likely see orders expand for the next 2-years. In chips and packaging, SpaceX is said to work STMicro, GlobalFoundries, and Innolux (packaging). $意法半導體(STM.US) $格芯(GFS.US) $特斯拉(TSLA.US) #SpaceX #semiconductors

Source: Dan Nystedt