MONTAGE TECH

📢 𝗝𝗨𝗦𝗧 𝗜𝗡: Montage Technology Begins Trial Production of Industry-First CXL 3.2 Memory eXpander Controller - $SK Hynix(SKHY.US) $AMD(AMD.US) $Intel(INTC.US)

👉 𝗞𝗲𝘆 𝗛𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁𝘀:

➤ 𝗠𝗼𝗻𝘁𝗮𝗴𝗲 𝗧𝗲𝗰𝗵𝗻𝗼𝗹𝗼𝗴𝘆 begins trial production of the industry's first 𝗖𝗫𝗟 𝟯.𝟮 𝗠𝗫𝗖 chip.

➤ Chip supports 𝗣𝗖𝗜𝗲 𝟲.𝘅 and 𝗖𝗫𝗟 𝟯.𝟮 with speeds up to 𝟲𝟰 𝗚𝗧/𝘀.

➤ Dual 𝗗𝗗𝗥𝟱 controllers support memory speeds up to 𝟴,𝟬𝟬𝟬 𝗠𝗧/𝘀.

➤ MXC enables 𝗺𝗲𝗺𝗼𝗿𝘆 𝗲𝘅𝗽𝗮𝗻𝘀𝗶𝗼𝗻, pooling, and tiered memory architectures.

➤ Supports multiple form factors, including 𝗣𝗖𝗜𝗲 𝗔𝗜𝗖 and 𝗘𝗗𝗦𝗙𝗙 modules.

➤ Integrated into next-generation CXL products from 𝗦𝗮𝗺𝘀𝘂𝗻𝗴 and 𝗦𝗞 𝗵𝘆𝗻𝗶𝘅.

➤ Compatible with 𝗜𝗻𝘁𝗲𝗹 𝗫𝗲𝗼𝗻 and 𝗔𝗠𝗗 𝗘𝗣𝗬𝗖 server platforms.

➤ Includes SDK, analysis, and testing tools to accelerate customer deployment.

👉 𝗪𝗵𝘆 𝗧𝗵𝗶𝘀 𝗠𝗮𝘁𝘁𝗲𝗿𝘀:

➤ Helps overcome traditional server memory capacity limitations for AI workloads.

➤ Advances the commercialization of 𝗖𝗫𝗟 technology across AI and cloud infrastructure.

➤ Supports growing demand for scalable, high-capacity memory in data centers.

➤ Strengthens the CXL ecosystem with backing from major memory and processor vendors.

👉 𝗘𝘅𝗽𝗲𝗿𝘁 𝗦𝘁𝗮𝘁𝗲𝗺𝗲𝗻𝘁𝘀:

𝗦𝘁𝗲𝗽𝗵𝗲𝗻 𝗧𝗮𝗶, President at Montage Technology:

"The trial production of the CXL 3.2 MXC chip marks an important milestone in Montage Technology's pursuit of CXL innovation and commercialization. As memory demands continue to surge in the AI era, we are providing our customers with high-bandwidth, large-capacity, and highly reliable memory expansion solutions, accelerating the large-scale adoption of CXL in data center and AI infrastructure."

𝗝𝗮𝗻𝗴𝘀𝗲𝗼𝗸 𝗖𝗵𝗼𝗶, VP of Memory Product Planning at Samsung Electronics:

"The combination of CXL 3.2 MXC with DDR5 memory technology offers data center customers a solution that balances performance and capacity. Our collaboration validates the value of CXL in increasing system memory capacity and resource utilization, and provides additional options for next-generation AI infrastructure."

𝗨𝗸𝘀𝗼𝗻𝗴 𝗞𝗮𝗻𝗴, Head of Next Gen Product Planning & Std at SK hynix:

"With the rapid adoption of large language models and generative AI, memory has become a critical factor in system performance. Montage Technology's MXC product demonstrates strong potential for supporting high-capacity memory expansion and resource sharing. We look forward to deeper collaboration in ecosystem validation and product innovation."

𝗗𝗿. 𝗗𝗲𝗯𝗲𝗻𝗱𝗿𝗮 𝗗𝗮𝘀 𝗦𝗵𝗮𝗿𝗺𝗮, Senior Fellow and Chief I/O Architect at Intel:

"AI, next-gen cloud systems, and today's industry economics are reshaping server memory architecture and driving demand for CXL. Montage Technology's CXL 3.2 MXC demonstrates how the maturing CXL ecosystem delivers protocol support, compatibility, and performance, helping to unlock the memory expansion capabilities of next-generation Intel Xeon platforms."

𝗔𝗺𝗶𝘁 𝗚𝗼𝗲𝗹, Corporate Vice President, Compute and Enterprise AI Platform Solutions Engineering at AMD:

"AI and data center workloads are driving continuous evolution of system architecture, making memory a key factor in performance and scalability. We look forward to our continued collaboration with Montage Technology on CXL technologies to deliver a foundation for building more flexible and efficient memory architectures."

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Analyst sees AI-driven memory and CPU tailwinds accelerating revenue growth, with higher chip content and demand recovery driving upside into 2026+.