
Valuation analysis

- P/E
- Price
- High
- Median
- Low
- P/B
- Price
- High
- Median
- Low
- P/S
- Price
- High
- Median
- Low
- Dividend Yield
- Price
- High
- Median
- Low
Institutional View & Shareholder
Analyst Ratings
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- Lowest--
TSMC’s certainty over capacity needs now extends 2-years out instead of one, media report, as the chip giant now engages contractors for new chip fabs or packaging plants 2-years ahead of time instead.....................
KLA Corp., the US chip equipment giant, inaugurated a new Taiwan headquarters and training center in Taoyuan, Taiwan on Friday, an NT$465 million investment, media report. The center is aimed at helpi......
Powertech, Taiwan’s 2nd biggest semiconductor packaging firm, will more than double 2026 capex to over NT$40 billion (US$1.3 billion), from NT$19 billion this year, media report, adding US$1 billion i...............
Winbond Electronics approved a new NT$35.59 billion capex budget (US$1.2 billion) to expand memory chip manufacturing capacity in Taiwan, up from NT$5.3 billion early this year, media report. The memo...............
TSMC will break ground on its first 1.4nm (14 Angstrom) fab in Taichung, Taiwan by end-2025, with mass production in the 2nd half-2028, media report, noting the A14 process will be developed at TSMC’s..................
