📢 𝗝𝗨𝗦𝗧 𝗜𝗡: Synopsys and TSMC Expand Partnership for Next-Generation AI and HPC Chip Design - $Synopsys(SNPS.US) $Taiwan Semiconductor(TSM.US)
👉 𝗞𝗲𝘆 𝗛𝗶𝗴𝗵𝗹𝗶𝗴𝗵𝘁𝘀:➤ 𝗦𝘆𝗻𝗼𝗽𝘀𝘆𝘀 and 𝗧𝗦𝗠𝗖 expand collaboration across advanced AI chip development.➤ Certified 𝗧𝗦𝗠𝗖 𝗔𝟭𝟰 EDA flows accelerate next-generation AI and HPC designs.➤ New 𝗮𝗴𝗲𝗻𝘁𝗶𝗰 𝗔𝗜 workflows automate analog, digital, and multi-die engineering tasks.➤ 𝗖𝗼𝗪𝗼𝗦® support enables integrated voltage regulator co-design for advanced AI systems.➤ 𝗧𝗦𝗠𝗖-𝗖𝗢𝗨𝗣𝗘™ collaboration advances co-packaged optics design and verification.➤ Synopsys achieved 𝗡𝟮𝗣 milestones for 𝗣𝗖𝗜𝗲 𝟳.𝟬, 𝗛𝗕𝗠𝟰, and LPDDR6.➤ Synopsys completed 𝟲𝟰𝗚 𝗨𝗖𝗜𝗲 IP tape-outs on 𝟮𝗻𝗺 and 𝟯𝗻𝗺 nodes.➤ Collaboration targets 𝗔𝗜, HPC, data center, automotive, and edge applications.➤ Expanded silicon-proven IP aims to accelerate deployment and reduce design risk.👉 𝗪𝗵𝘆 𝗧𝗵𝗶𝘀 𝗠𝗮𝘁𝘁𝗲𝗿𝘀:➤ Deepens 𝗦𝘆𝗻𝗼𝗽𝘀𝘆𝘀' role in TSMC's advanced-node semiconductor ecosystem.➤ 𝗔𝟭𝟰 certification helps customers prepare designs for future TSMC process technology.➤ Agentic AI could reduce engineering effort across increasingly complex chip workflows.➤ 𝗛𝗕𝗠𝟰 and 𝗣𝗖𝗜𝗲 𝟳.𝟬 IP address critical next-generation AI connectivity requirements.➤ CoWoS and UCIe advances support increasingly complex 𝗺𝘂𝗹𝘁𝗶-𝗱𝗶𝗲 𝗔𝗜 architectures.👉 𝗘𝘅𝗽𝗲𝗿𝘁 𝗦𝘁𝗮𝘁𝗲𝗺𝗲𝗻𝘁𝘀:𝗠𝗶𝗰𝗵𝗮𝗲𝗹 𝗕𝘂𝗲𝗵𝗹𝗲𝗿-𝗚𝗮𝗿𝗰𝗶𝗮, Senior Vice President at Synopsys:"As AI systems continue to grow in scale and complexity, customers require proven IP, intelligent design solutions, and advanced packaging methodologies that work together seamlessly. Our joint innovations with TSMC address the continuum of silicon to systems co-design capabilities needed to accelerate development of next-generation AI and high-performance computing systems."𝗔𝘃𝗲𝗲𝗸 𝗦𝗮𝗿𝗸𝗮𝗿, Director of the Ecosystem and Alliance Management Division at TSMC:"Our collaboration with Open Innovation Platform® (OIP) ecosystem partners like Synopsys continues to meet the rapidly growing demands of AI and high-performance computing. By combining certified EDA solutions and silicon-proven IP portfolio from Synopsys with our latest process and packaging innovations, we are enabling customers to push the boundaries of performance, integration, and energy efficiency to shape the future of AI."





