ASE Technology, the chip packaging and testing giant, will buy a plant from Win Semiconductors for NT$6.5 billion (US$217 million) to add new advanced packaging capacity as currently full, media report, due to strong demand for AI and HPC (high performance computing) chip packaging (2.5D, 3D, wafer-level packaging). ASE expects US$1 billion more revenue from advanced packaging than last year. It is also rapidly expanding advanced test capacity. $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) $Taiwan Semiconductor(TSM.US) #semiconductors

Source: Dan Nystedt