KLAC
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ASE expects advanced semiconductor packaging revenue to reach US$3.2 billion this year, a revision from its prior forecast of $2.6B, and double last year’s $1.6B, media report, adding ASE said it will spend $7B on capex this year. The chip packaging giant held a groundbreaking ceremony Wednesday for a new NT$17.8B (US$570M) advanced plant in Kaohsiung (south), Taiwan’s Nanzih Industrial Park, its biggest domestic investment in 5-years. Construction will finish in the 2nd quarter 2028. $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) $Applied Materials(AMAT.US) $ASML(ASML.US) $BESI $Nova(NVMI.US) $KLA(KLAC.US)
Source: Dan Nystedt
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