
Valuation analysis

- P/E
- Price
- High
- Median
- Low
- P/B
- Price
- High
- Median
- Low
- P/S
- Price
- High
- Median
- Low
- Dividend Yield
- Price
- High
- Median
- Low
Institutional View & Shareholder
Analyst Ratings
- Price--
- Highest--
- Lowest--
KLA sees leading-edge momentum continuing into 2026. DRAM/HBM investment to continue. China normalization and non-China mature node stable. Advanced packaging (AP) will grow as well. An area of streng...
SK Hynix plans to build a new advanced semiconductor packaging R&D and test production line factory in Cheongju, South Korea, media report, and has already begun work demolishing a plant purchased fro...
India’s Tata Electronics is in advanced talks to buy a semiconductor packaging plant in Malaysia, with Silterra, X-Fab, Globetronics, seen as possible targets, media report, adding the plant would dee...
Japan’s Ajinomoto, producer of ABF film for the substrates used in GPU and CPU packaging, will invest ¥25 billion (US$166 million) to boost capacity of the insulating material by 50% over 5-years, Nik............
TSMC's non-wafer revenue grew >2.5x in 2024 from 2019 levels (21% CAGR). The majority of non-wafer revenue is from advanced packaging, which will account for 10%+ of TSMC revenue in CY25. Non-wafer ca...


