Packaging Corp of America

Netflix?!

TSMC's supplier doubling capacity for “2000X demand” isn't hyperbole. It's confirmation of the insatiable infrastructure build for AI.

S&P at ATH but Netflix crashed?! This market makes no sense. Thinking of taking profits

It has been a rollercoaster for the global markets. Stay safe everyone! 😊

It has been a rollercoaster ride for the global markets with global politics in the headlines. Take it easy and stay safe everyone. 😊

Netflix is the clear surprise today.

Stay invested, stay focused, stay AI!

Stay invested, stay focused, stay AI!

Stay invested, stay focused, stay AI!

Stay invested, stay focused, stay AI!

Stay invest, stay focused all the way!

KLA sees leading-edge momentum continuing into 2026. DRAM/HBM investment to continue. China normalization and non-China mature node stable. Advanced packaging (AP) will grow as well. An area of strength for KLA as it revised its AP revenue 3 times already this year to $925M (3x vs 2023). KLA will outperform 2025 WFE growth of MSD%. AP overall WFE is now $10B. Earlier in earnings call KLA noted it can hit $14B revenue target without needing the $125B WFE market.

Source: Sravan Kundojjala

SK Hynix plans to build a new advanced semiconductor packaging R&D and test production line factory in Cheongju, South Korea, media report, and has already begun work demolishing a plant purchased from LG on the site. The new plant, called “P&T 7” will be critical to AI memory chips called HBM (high bandwidth memory) due to the importance of how the chips are packaged. #SKhynix #Samsung #HBM #semiconductors

Source: Dan Nystedt

India’s Tata Electronics is in advanced talks to buy a semiconductor packaging plant in Malaysia, with Silterra, X-Fab, Globetronics, seen as possible targets, media report, adding the plant would deepen Tata’s work in packaging, and give it geographic diversity. #India #Tata #Malaysia #semiconductors #semiconductor

Source: Dan Nystedt

Japan’s Ajinomoto, producer of ABF film for the substrates used in GPU and CPU packaging, will invest ¥25 billion (US$166 million) to boost capacity of the insulating material by 50% over 5-years, Nikkei reports, adding it has already spent ¥25 billion over the past 2-years expanding production. The food company used its amino acid expertise to create ABF (Ajinomoto Build-up Film). $NVIDIA(NVDA.US) $Intel(INTC.US) $AMD(AMD.US) #semiconductors #semiconductor https://t.co/Poec4zLq1L

Source: Dan Nystedt

TSMC's non-wafer revenue grew >2.5x in 2024 from 2019 levels (21% CAGR). The majority of non-wafer revenue is from advanced packaging, which will account for 10%+ of TSMC revenue in CY25. Non-wafer capex will grow by 33% to $4B+ in '25. GM for this business still below corporate average though.

Source: Sravan Kundojjala