Defiance Daily Target 2X Short TSM ETF

TSMC vs Intel: TSMC is working with Kinsus Interconnect to develop an EMIB-like technology to keep customers from switching to Intel’s EMIB advanced packaging, media report. Intel’s EMIB uses silicon bridges between chips for interconnect, instead of the silicon interposer TSMC uses in CoWoS packaging. Kinsus is a substrate maker and would provide bridge embedding work and manufacturing expertise. There has been talk Google might turn to Intel for EMIB. $Taiwan Semiconductor(TSM.US) $Intel(INTC.US) #semiconductors

Source: Dan Nystedt

AUO, the display panel maker, plans to spend NT$8.64 billion (US$267M) for an FOPLP advanced chip packaging pilot line that uses glass substrates: Glass Core (structure), Redistribution Layer (RDL, fine metal wiring) and Through Glass Via (TGV, tiny holes drilled through the glass to connect layers). FOPLP plans aim at LEO satellite antennas, Micro LEDs and optical communications. AUO’s main rival in Taiwan, Innolux, has already started developing its advanced semiconductor packaging business. In February, AUO’s board approved NT$14.67B in capex spending. $Taiwan Semiconductor(TSM.US) $Advanced Semiconductor Engineering(ASX.US) $Amkor Tech(AMKR.US) #advancedpackaging #semiconductors

Source: Dan Nystedt

Re-acquired some $Meta Platforms(META.US). After reducing positions in $Alphabet(GOOGL.US), holding steady. Overweight position in $Taiwan Semiconductor(TSM.US) remains unchanged; memory sector has suffered significant losses this round, so I'm ignoring it. For hardware, selling new high calls on sharp rallies; current assessment is that hardware is unlikely to return to June highs. Focus for H2 is on major cloud providers; both Meta and Google show desire to increase positions. Main thoughts and assessments: The narrative of commoditization of models is strengthening, and the competitive-cooperative relationship between cloud and frontier models has entered a stage of mutually beneficial achievement. Overall, cloud may have the upper hand.

$Apple(AAPL.US) earnings beat expectations:

Revenue: $109.4B 📈 16% vs expected $108.8B

Earnings per share: $2.02 vs expected $1.89

iPhone revenue: $54.25B vs expected $53.6B

Apple rose early 📈, then pulled back after earnings!

By the way, I rebalanced some positions to $Tesla(TSLA.US) $Taiwan Semiconductor(TSM.US) a few days ago 😂

📢 𝐉𝐔𝐒𝐓 𝐈𝐍: TSMC Develops AI Chip Packaging Tech to Counter Intel - Information - $Taiwan Semiconductor(TSM.US) $Intel(INTC.US)

Are we ready for another spin ?

Can’t help it, I wanted to hold this stock long term!

My little baby when are your rolling back upwards as a roller coaster does !$Taiwan Semiconductor(TSM.US)

🎢🛼🆙⬆️🙏😝

TSMC’s 1.4nm fab construction in central Taiwan is ahead of schedule despite the summer heat, and the first will be done by April, 2027, media report. The 1st phase of piling work is already done and construction of the central utility plant (CUP) and office buildings has already begun. Contracts for the first 2 of four fabs have been awarded to Dacin Construction and Fu Tsu Construction. Media cite Central Taiwan Science Park Director-General Maw-Shin Hsu for the information. $Taiwan Semiconductor(TSM.US) #semiconductors

Source: Dan Nystedt

TSMC’s operation in Kumamoto, Japan is recovering and will need some time to recalibrate equipment after the 7.1-magnitude earthquake, tripping safety systems and halting production, media report. TSMC said the fab structure, water supply, power and safety systems are all normal, and detailed inspections continue. Construction of the 2nd fab has resumed.

Source: Dan Nystedt

TSMC evacuated all fab workers at its Japan subsidiary in Kumamoto after a 7.1-magnitude earthquake struck the prefecture, media report, adding all are safe and accounted for. Employees returned to the fab after its structural integrity was confirmed and began inspecting lines and assessing damage. Nearby construction has stopped due to expected aftershocks. Taiwan officials say investments in the area remain so far unaffected. $Taiwan Semiconductor(TSM.US) #Kumamoto #semiconductors

Source: Dan Nystedt

Sold some $BRK.B to raise some cash💰

Bought more $Taiwan Semiconductor(TSM.US) $Tesla(TSLA.US) long calls

Not investment advice!

TSMC’s hometown in Japan is building the ‘Kumamoto Science Park’ and has already inked an MOU to work with Taiwan’s Hsinchu Science Park to cooperate in semiconductors, startup development, industrial exchange, supply chain resilience and more, media report, adding Taiwan’s Industrial Technology Research Institute (ITRI) also signed an MOU to work with the science park to strengthen industrial, academic and research kinks between Taiwan and Japan. $Taiwan Semiconductor(TSM.US) #semiconductors #SciencePark #Kumamoto

Source: Dan Nystedt

MediaTek and Qualcomm are both raising prices on smartphone chips in the 3rd quarter due to rising costs across the supply chain – including wafers, packaging materials, services, etc. – caused by the AI data center build out, media report, with MediaTek price increases already in place and Qualcomm’s due Sep. 1.

Source: Dan Nystedt

BofA: United Microelectronics

The AI bubble might soon be popping:

$Taiwan Semiconductor(TSM.US)

Sellers took control today as tech sentiment turned cautious after recent highs. This looks more like profit-taking than a shift in institutional confidence.

Demand for advanced foundry capacity remains unmatched. Most major AI hardware players still rely on TSMC, reinforcing its long-term competitive edge.

I’m staying quiet through the weakness and focusing on the bigger picture. Short-term volatility rarely changes the value of essential infrastructure.

@Captain's Treasure

$NVIDIA(NVDA.US)

Nvidia looks tired at these levels. For the past two weeks, she has been consolidating in a tight channel undecided where to go. AMD looks much stronger consolidating at around the ATH levels. AVGO looks similar to Nvidia as well as TSM.

And Tech is looking for a direction as well. It looks like it wants to bottom. The bounce will be telling to see if it will make rally to new high.

@Captain's Treasure

📊 𝐈𝐍𝐕𝐄𝐒𝐓𝐎𝐑 𝐍𝐎𝐓𝐄: Bernstein Reaffirms Bullish View on Memory Chipmakers After Major AI Partnerships - $NVIDIA(NVDA.US) $SK Hynix(SKHY.US) $Micron Tech(MU.US) $Sandisk(SNDK.US) $Western Digital(WDC.US) $Seagate Tech(STX.US)

Taiwan’s semiconductor industry will account for 24.34% of Taiwan’s total power consumption in 2030, up from 17.71% this year, media report, citing state-run Taipower. That means 80 billion kWh by 2030, from 52 billion kWh this year. By 2035, the semiconductor industry’s power use will hit 110 billion kWh, or 30.38% of Taiwan’s electricity. TSMC, the biggest chip maker in Taiwan, operates 19 advanced fabs and packaging plants in Taiwan now, with 13 more under construction across Taiwan. $Taiwan Semiconductor(TSM.US) $United Microelectronics(UMC.US) $Micron Tech(MU.US) $Advanced Semiconductor Engineering(ASX.US) #semiconductors

Source: Dan Nystedt

Nvidia’s first 'Made in USA' GB300 AI chips have rolled off the line at TSMC Arizona, media report, noting CoWoS advanced packaging will be the final step to fully localizing the GB300. The 4nm chip is also known as Grace Blackwell Ultra. $NVIDIA(NVDA.US) $Taiwan Semiconductor(TSM.US) $Amkor Tech(AMKR.US) #semiconductors #Arizona

Source: Dan Nystedt

TSMC’s first 2nm fab hit a production milestone of 20,000 wafers-per-month (wpm), the best among 5 fabs ramping 2nm capacity in Taiwan, media report, citing unnamed industry sources. Fab 20 in Hsinchu sits by TSMC’s main R&D fab, giving it a prime position in the rollout of new process technologies. Analysts are optimistic the strong 2nm ramp up along with a diverse group of customers, from AI accelerators and smartphone chips, to CPUs and GPUs. $Taiwan Semiconductor(TSM.US) $Apple(AAPL.US) $AMD(AMD.US) $Qualcomm(QCOM.US) #Mediatek

Source: Dan Nystedt