TSMC is fast tracking next-generation CoPoS (Chip on Panel on Substrate) packaging and is requiring equipment and materials suppliers to sign exclusive multi-year supply contracts to ensure technical details don’t leak to rivals, media report, noting the move comes on the heels of reports Intel is looking to Taiwan suppliers to boost its advanced packaging capacity. $Taiwan Semiconductor(TSM.US) $Intel(INTC.US) $Advanced Semiconductor Engineering(ASX.US) #Samsung #semiconductors #semiconductor
Source: Dan Nystedt
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