Rumor: TSMC will partner with Innolux on FOPLP (Fan-out Panel-Level-Packaging) advanced packaging for AI chips, media report. TSMC will work with Innolux at its Longtan plant, aiming to use FOPLP on future AI and HPC chips. Innolux is already said to be working with SpaceX on FOPLP, and its annual report says monthly FOPLP output has already 10x’ed to 40 million units, at high yield. Capacity is full. $Taiwan Semiconductor(TSM.US) #Innolux $3481TW $2303TW #semiconductors #semiconductor #FOPLP
Source: Dan Nystedt
The copyright of this article belongs to the original author/organization.
The views expressed herein are solely those of the author and do not reflect the stance of the platform. The content is intended for investment reference purposes only and shall not be considered as investment advice. Please contact us if you have any questions or suggestions regarding the content services provided by the platform.
