Hardik Shah
2026.07.31 12:06

๐Ÿ“ข ๐—๐—จ๐—ฆ๐—ง ๐—œ๐—ก: Montage Technology Begins Trial Production of Industry-First CXL 3.2 Memory eXpander Controller - $SK Hynix(SKHY.US) $AMD(AMD.US) $Intel(INTC.US)

๐Ÿ‘‰ ๐—ž๐—ฒ๐˜† ๐—›๐—ถ๐—ด๐—ต๐—น๐—ถ๐—ด๐—ต๐˜๐˜€:

โžค ๐— ๐—ผ๐—ป๐˜๐—ฎ๐—ด๐—ฒ ๐—ง๐—ฒ๐—ฐ๐—ต๐—ป๐—ผ๐—น๐—ผ๐—ด๐˜† begins trial production of the industry's first ๐—–๐—ซ๐—Ÿ ๐Ÿฏ.๐Ÿฎ ๐— ๐—ซ๐—– chip.

โžค Chip supports ๐—ฃ๐—–๐—œ๐—ฒ ๐Ÿฒ.๐˜… and ๐—–๐—ซ๐—Ÿ ๐Ÿฏ.๐Ÿฎ with speeds up to ๐Ÿฒ๐Ÿฐ ๐—š๐—ง/๐˜€.

โžค Dual ๐——๐——๐—ฅ๐Ÿฑ controllers support memory speeds up to ๐Ÿด,๐Ÿฌ๐Ÿฌ๐Ÿฌ ๐— ๐—ง/๐˜€.

โžค MXC enables ๐—บ๐—ฒ๐—บ๐—ผ๐—ฟ๐˜† ๐—ฒ๐˜…๐—ฝ๐—ฎ๐—ป๐˜€๐—ถ๐—ผ๐—ป, pooling, and tiered memory architectures.

โžค Supports multiple form factors, including ๐—ฃ๐—–๐—œ๐—ฒ ๐—”๐—œ๐—– and ๐—˜๐——๐—ฆ๐—™๐—™ modules.

โžค Integrated into next-generation CXL products from ๐—ฆ๐—ฎ๐—บ๐˜€๐˜‚๐—ป๐—ด and ๐—ฆ๐—ž ๐—ต๐˜†๐—ป๐—ถ๐˜….

โžค Compatible with ๐—œ๐—ป๐˜๐—ฒ๐—น ๐—ซ๐—ฒ๐—ผ๐—ป and ๐—”๐— ๐—— ๐—˜๐—ฃ๐—ฌ๐—– server platforms.

โžค Includes SDK, analysis, and testing tools to accelerate customer deployment.

๐Ÿ‘‰ ๐—ช๐—ต๐˜† ๐—ง๐—ต๐—ถ๐˜€ ๐— ๐—ฎ๐˜๐˜๐—ฒ๐—ฟ๐˜€:

โžค Helps overcome traditional server memory capacity limitations for AI workloads.

โžค Advances the commercialization of ๐—–๐—ซ๐—Ÿ technology across AI and cloud infrastructure.

โžค Supports growing demand for scalable, high-capacity memory in data centers.

โžค Strengthens the CXL ecosystem with backing from major memory and processor vendors.

๐Ÿ‘‰ ๐—˜๐˜…๐—ฝ๐—ฒ๐—ฟ๐˜ ๐—ฆ๐˜๐—ฎ๐˜๐—ฒ๐—บ๐—ฒ๐—ป๐˜๐˜€:

๐—ฆ๐˜๐—ฒ๐—ฝ๐—ต๐—ฒ๐—ป ๐—ง๐—ฎ๐—ถ, President at Montage Technology:

"The trial production of the CXL 3.2 MXC chip marks an important milestone in Montage Technology's pursuit of CXL innovation and commercialization. As memory demands continue to surge in the AI era, we are providing our customers with high-bandwidth, large-capacity, and highly reliable memory expansion solutions, accelerating the large-scale adoption of CXL in data center and AI infrastructure."

๐—๐—ฎ๐—ป๐—ด๐˜€๐—ฒ๐—ผ๐—ธ ๐—–๐—ต๐—ผ๐—ถ, VP of Memory Product Planning at Samsung Electronics:

"The combination of CXL 3.2 MXC with DDR5 memory technology offers data center customers a solution that balances performance and capacity. Our collaboration validates the value of CXL in increasing system memory capacity and resource utilization, and provides additional options for next-generation AI infrastructure."

๐—จ๐—ธ๐˜€๐—ผ๐—ป๐—ด ๐—ž๐—ฎ๐—ป๐—ด, Head of Next Gen Product Planning & Std at SK hynix:

"With the rapid adoption of large language models and generative AI, memory has become a critical factor in system performance. Montage Technology's MXC product demonstrates strong potential for supporting high-capacity memory expansion and resource sharing. We look forward to deeper collaboration in ecosystem validation and product innovation."

๐——๐—ฟ. ๐——๐—ฒ๐—ฏ๐—ฒ๐—ป๐—ฑ๐—ฟ๐—ฎ ๐——๐—ฎ๐˜€ ๐—ฆ๐—ต๐—ฎ๐—ฟ๐—บ๐—ฎ, Senior Fellow and Chief I/O Architect at Intel:

"AI, next-gen cloud systems, and today's industry economics are reshaping server memory architecture and driving demand for CXL. Montage Technology's CXL 3.2 MXC demonstrates how the maturing CXL ecosystem delivers protocol support, compatibility, and performance, helping to unlock the memory expansion capabilities of next-generation Intel Xeon platforms."

๐—”๐—บ๐—ถ๐˜ ๐—š๐—ผ๐—ฒ๐—น, Corporate Vice President, Compute and Enterprise AI Platform Solutions Engineering at AMD:

"AI and data center workloads are driving continuous evolution of system architecture, making memory a key factor in performance and scalability. We look forward to our continued collaboration with Montage Technology on CXL technologies to deliver a foundation for building more flexible and efficient memory architectures."

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