ASE, the chip packaging giant, expects to spend more than its original US$7 billion on capex this year due to strong AI demand, and announced an NT$108.3 billion (US$3.4B) plan to build a chip testing cluster in Kaohsiung, south Taiwan, media report, citing ASE COO Tien Wu, and adding ASE plans to break ground on Six new advanced packaging plants this year. ASE expects operations to begin at the Renwu, Kaohsiung site in April, 2027. The 2nd phase of expansion is set for October, 2027. $Advanced Semiconductor Engineering(ASX.US) $Taiwan Semiconductor(TSM.US) $Amkor Tech(AMKR.US) $BESI #Advantest $KLA(KLAC.US) $Teradyne(TER.US) #semiconductors

Source: Dan Nystedt