TSMC is targeting 40,000 wafers per month (wpm) of SoIC advanced packaging capacity in Taiwan in 2027 and a 2028 start to TSMC Arizona production of InFO and CoWoS advanced packaging at the AP9 plant as the chip giant speeds up construction to meet massive AI related demand, including AI smartphones, media report, citing unnamed industry sources. SoIC is TSMC’s 3D stacking technology, more advanced than CoWoS, basically like building chip sandwiches, with better power savings, more interconnects, improved performance. $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) $Apple(AAPL.US) $AMD(AMD.US) $Broadcom(AVGO.US) $Alphabet(GOOGL.US) $Amazon(AMZN.US)
Source: Dan Nystedt
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