UMC’s deep trench capacitor (DTC) technology has won it a place in Qualcomm’s supply chain, as this critical component enhances advanced packaging by shortening the power delivery path via embedding high-density capacitors directly in the silicon interposer or advanced packaging substrate, media report, improving chip performance. $Qualcomm(QCOM.US) $United Microelectronics(UMC.US) #semiconductors
Source: Dan Nystedt
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