Chinese company, Qinghe Wafer, recently announced a Hybrid Bonding tool with impressive specs:
▫️Bonding accuracy: 100nm▫️UPH: 1,000I'd assume those don't go together; meaning they are not hitting 100nm accuracy at 1,000 UPH.But still, it pays to keep a keen eye on Chinese Equipment Manufacturers for breakthroughs in advanced packaging machines.This article also talks about Chinese companies developing temporary bonding/debonding tools, which are key for applications like HBM stacks and CoWoS packages.$BESI $SMHN #ASMPT #EVG $Kulicke and Soffa(KLIC.US) $Camtek(CAMT.US)Source: Chips & Wafers
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