With #CPO adoption around the corner, and #HBM5 looking to reach 20 layers, #HybridBonding has been heating up. And the name of the game is 'collaboration'.
$Applied Materials(AMAT.US) is working with $BESI, and $SMHN is partnered with #SET.In each case, the former handles the Front-End die preparation steps and the later does the precision die attach steps.#ASMPT is not going to be left behind, and I would expect to see some news soon regarding a partnership with a Front-End equipment company.My guess is $TE Connectivity(TEL.US), given their recent commentary around Hybrid Bonding; albeit has thus far been more focused on W2W rather than D2W.Will it be TEL? Only time will tell; no pun intended.Source: Chips & Wafers
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